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Diffusion Bonding of Co to TiAu High Temperature Shape Memory Alloy
Diffusion Bonding of Co to TiAu High Temperature Shape Memory Alloy
Diffusion Bonding of Co to TiAu High Temperature Shape Memory Alloy
Okimori, Y. (author) / Inamura, T. (author) / Hosoda, H. (author) / Wakashima, K. (author)
MATERIALS TRANSACTIONS ; 49 ; 1998-2005
2008-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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