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Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding
Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding
Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding
Kunimine, T. (author) / Takata, N. (author) / Tsuji, N. (author) / Fujii, T. (author) / Kato, M. (author) / Onaka, S. (author)
2009-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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