Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding: Fid-Bau Portal

Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding

Kunimine, T. / Takata, N. / Tsuji, N. / Fujii, T. / Kato, M. / Onaka, S.

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Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding

Kunimine, T. / Takata, N. / Tsuji, N. / Fujii, T. / Kato, M. / Onaka, S.

Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding

Kunimine, T. / Takata, N. / Tsuji, N. / Fujii, T. / Kato, M. / Onaka, S.

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Document information

Title:

Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding

Contributors:

Kunimine, T. (author) / Takata, N. (author) / Tsuji, N. (author) / Fujii, T. (author) / Kato, M. (author) / Onaka, S. (author)

Published in:

Severe Plastic Deformation for Production of Ultrafine Structures and Unusual Mechanical Properties: Understanding Mechanisms ; 64-69

MATERIALS TRANSACTIONS ; 50

Publication date:

2009-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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