Cyclic creep and fracture of a Cu-SiO2 bicrystal at an intermediate temperature of 673K: Fid-Bau Portal

Cyclic creep and fracture of a Cu-SiO2 bicrystal at an intermediate temperature of 673K

Miura, H. / Sakai, T. / Kato, M.

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Cyclic creep and fracture of a Cu-SiO2 bicrystal at an intermediate temperature of 673K

Miura, H. / Sakai, T. / Kato, M.

Cyclic creep and fracture of a Cu-SiO2 bicrystal at an intermediate temperature of 673K

Miura, H. / Sakai, T. / Kato, M.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Cyclic creep and fracture of a Cu-SiO2 bicrystal at an intermediate temperature of 673K

Contributors:

Miura, H. (author) / Sakai, T. (author) / Kato, M. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 510/511 ; 413-416

Publication date:

2009-01-01

Size:

4 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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