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Performance evaluation of LSM-metallic interconnect composite films prepared by plasma sputtering method

Chu, C.L. / Lee, S. / Lee, J. / Lee, T.-H.

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Performance evaluation of LSM-metallic interconnect composite films prepared by plasma sputtering method

Chu, C.L. / Lee, S. / Lee, J. / Lee, T.-H.

Performance evaluation of LSM-metallic interconnect composite films prepared by plasma sputtering method

Chu, C.L. / Lee, S. / Lee, J. / Lee, T.-H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Performance evaluation of LSM-metallic interconnect composite films prepared by plasma sputtering method

Contributors:

Chu, C.L. (author) / Lee, S. (author) / Lee, J. (author) / Lee, T.-H. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 25 ; 582-586

Publication date:

2009-01-01

Size:

5 pages

ISSN:

0267-0836

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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