Thermally activated dislocation depinning at a grain boundary in nanocrystalline and ultrafine-grained materials: Fid-Bau Portal

Thermally activated dislocation depinning at a grain boundary in nanocrystalline and ultrafine-grained materials

Kato, M.

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Thermally activated dislocation depinning at a grain boundary in nanocrystalline and ultrafine-grained materials

Kato, M.

Thermally activated dislocation depinning at a grain boundary in nanocrystalline and ultrafine-grained materials

Kato, M.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermally activated dislocation depinning at a grain boundary in nanocrystalline and ultrafine-grained materials

Contributors:

Kato, M. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 516 ; 276-282

Publication date:

2009-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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