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    High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

    New search for: Zhao, M.L.
    New search for: Zhao, B.
    New search for: Wang, Y.Q.
    New search for: Gao, G.F.
    New search for: Zhao, B.
    New search for: Xu, X.
    New search for: Cai, G.
    New search for: Kang, R.

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    High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

    New search for: Zhao, M.L.
    New search for: Zhao, B.
    New search for: Wang, Y.Q.
    New search for: Gao, G.F.
    New search for: Zhao, B.
    New search for: Xu, X.
    New search for: Cai, G.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

    New search for: Zhao, M.L.
    New search for: Zhao, B.
    New search for: Wang, Y.Q.
    New search for: Gao, G.F.
    New search for: Zhao, B.
    New search for: Xu, X.
    New search for: Cai, G.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

    Contributors:

    Zhao, M.L. (author) / Zhao, B. (author) / Wang, Y.Q. (author) / Gao, G.F. (author) / Zhao, B. / Xu, X. / Cai, G. / Kang, R.

    Published in:

    Advances in Grinding and Abrasive Technology XV ; 609-613

    KEY ENGINEERING MATERIALS ; 416

    Publication date:

    2009-01-01

    Size:

    5 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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