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    Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

    New search for: Cheng, C.-q.
    New search for: Zhao, J.
    New search for: Xu, Y.

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    Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

    New search for: Cheng, C.-q.
    New search for: Zhao, J.
    New search for: Xu, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

    New search for: Cheng, C.-q.
    New search for: Zhao, J.
    New search for: Xu, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

    Contributors:

    Cheng, C.-q. (author) / Zhao, J. (author) / Xu, Y. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 359-367

    Publication date:

    2010-01-01

    Size:

    9 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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