Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper: Fid-Bau Portal

Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Lin, Y.W. / Kuo, J.C. / Lui, K.T. / Chen, D.

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Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Lin, Y.W. / Kuo, J.C. / Lui, K.T. / Chen, D.

Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Lin, Y.W. / Kuo, J.C. / Lui, K.T. / Chen, D.

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Document information

Title:

Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Contributors:

Lin, Y.W. (author) / Kuo, J.C. (author) / Lui, K.T. (author) / Chen, D. (author) / Chandra, T. / Wanderka, N. / Reimers, W. / Ionescu, M.

Published in:

THERMEC 2009 Part 3 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009 ; 2841-2845

MATERIALS SCIENCE FORUM ; 638/642

Publication date:

2010-01-01

Size:

5 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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