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    Recrystallization Behaviors of an Al-Zn-Mg-Cu Alloy during Multi-Pass Hot Compression

    New search for: Shen, J.
    New search for: Li, J.P.
    New search for: Yan, L.M.
    New search for: Yan, X.D.
    New search for: Chandra, T.
    New search for: Wanderka, N.
    New search for: Reimers, W.
    New search for: Ionescu, M.

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    Recrystallization Behaviors of an Al-Zn-Mg-Cu Alloy during Multi-Pass Hot Compression

    New search for: Shen, J.
    New search for: Li, J.P.
    New search for: Yan, L.M.
    New search for: Yan, X.D.
    New search for: Chandra, T.
    New search for: Wanderka, N.
    New search for: Reimers, W.
    New search for: Ionescu, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Recrystallization Behaviors of an Al-Zn-Mg-Cu Alloy during Multi-Pass Hot Compression

    New search for: Shen, J.
    New search for: Li, J.P.
    New search for: Yan, L.M.
    New search for: Yan, X.D.
    New search for: Chandra, T.
    New search for: Wanderka, N.
    New search for: Reimers, W.
    New search for: Ionescu, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Recrystallization Behaviors of an Al-Zn-Mg-Cu Alloy during Multi-Pass Hot Compression

    Contributors:

    Shen, J. (author) / Li, J.P. (author) / Yan, L.M. (author) / Yan, X.D. (author) / Chandra, T. / Wanderka, N. / Reimers, W. / Ionescu, M.

    Published in:

    THERMEC 2009 Part 1 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009 ; 327-332

    MATERIALS SCIENCE FORUM ; 638/642

    Publication date:

    2010-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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