Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics: Fid-Bau Portal

Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Kreuzpaintner, J. / Wooldridge, K. / Gerrity, D. / Clark, B. / Deju, H.

Access

Page navigation

Export, share and cite

Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Kreuzpaintner, J. / Wooldridge, K. / Gerrity, D. / Clark, B. / Deju, H.

Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Kreuzpaintner, J. / Wooldridge, K. / Gerrity, D. / Clark, B. / Deju, H.

Access

Page navigation

Export, share and cite

Document information

Title:

Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Contributors:

Published in:

ADVANCING MICROELECTRONICS ; 37 ; 10-17

Publication date:

2010-01-01

Size:

8 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

Lloyd, J. R. / Thompson, C. V. | British Library Online Contents | 1993

Perumalraj, R. / Anilkumar, A. / Devi, A.S.N. et al. | British Library Online Contents | 2011

van Raamsdonk, G.W. / Oepkes, J. / Ingham, M.P. | Engineering Index Backfile | 1965

Sokolova Аlla G. / Gotlib Elena M. / Khasanova Аlmira R. et al. | DOAJ | 2019

Free access

British Library Online Contents | 1996