A platform for research: civil engineering, architecture and urbanism
Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders
Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders
Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders
Yan, Y.F. (author) / Wang, G.X. (author) / Song, K.X. (author) / Zhao, K.I. (author) / Han, Y. / Wang, T. / Zhou, S.
2010-01-01
7 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Creep-fatigue life assessment for three kinds of solders
British Library Online Contents | 2012
|Impression creep of monolithic and composite lead free solders
British Library Online Contents | 2007
|On the creep rupture life prediction
British Library Online Contents | 1998
|Wettability of Lead-Free Solders on Gold-Plated Copper Substrates
British Library Online Contents | 2008
|Comparison of Wettability for Sn-Based Solders on Copper and Aluminum Substrates
British Library Online Contents | 2011
|