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Change of Young's Modulus with Increasing Applied Tensile Strain in Open Cell Nickel and Copper Foams
Change of Young's Modulus with Increasing Applied Tensile Strain in Open Cell Nickel and Copper Foams
Change of Young's Modulus with Increasing Applied Tensile Strain in Open Cell Nickel and Copper Foams
Ochiai, S. (author) / Nakano, S. (author) / Fukazawa, Y. (author) / Aly, M.S. (author) / Okuda, H. (author) / Kato, K. (author) / Isobe, T. (author) / Kita, K. (author) / Honma, K. (author)
MATERIALS TRANSACTIONS ; 51 ; 925-932
2010-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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