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    Palladium - Free Activation Process for Electroless Nickel Plating of Acrylonitrile Butadiene Styrene Plastic

    New search for: Sun, S.
    New search for: Hong, W.-y.
    New search for: Shi, W.

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    Palladium - Free Activation Process for Electroless Nickel Plating of Acrylonitrile Butadiene Styrene Plastic

    New search for: Sun, S.
    New search for: Hong, W.-y.
    New search for: Shi, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Palladium - Free Activation Process for Electroless Nickel Plating of Acrylonitrile Butadiene Styrene Plastic

    New search for: Sun, S.
    New search for: Hong, W.-y.
    New search for: Shi, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Palladium - Free Activation Process for Electroless Nickel Plating of Acrylonitrile Butadiene Styrene Plastic

    Contributors:

    Sun, S. (author) / Hong, W.-y. (author) / Shi, W. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 43 ; 49-51

    Publication date:

    2010-01-01

    Size:

    3 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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