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Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates
Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates
Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates
Sobiech, M. (author) / Kruger, C. (author) / Welzel, U. (author) / Wang, J.Y. (author) / Mittemeijer, E.J. (author) / Hugel, W. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 2166-2174
2010-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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