Electrodeposition of Ni and Ni-Cu Nanowires in Rectified Porous Anodic Alumina Membrane: Fid-Bau Portal

Electrodeposition of Ni and Ni-Cu Nanowires in Rectified Porous Anodic Alumina Membrane

Zuo, Y. / Tang, J. / Li, X.T. / Zhao, Y. / Gong, H.L. / Qiu, S.L.

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Electrodeposition of Ni and Ni-Cu Nanowires in Rectified Porous Anodic Alumina Membrane

Zuo, Y. / Tang, J. / Li, X.T. / Zhao, Y. / Gong, H.L. / Qiu, S.L.

Electrodeposition of Ni and Ni-Cu Nanowires in Rectified Porous Anodic Alumina Membrane

Zuo, Y. / Tang, J. / Li, X.T. / Zhao, Y. / Gong, H.L. / Qiu, S.L.

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Title:

Electrodeposition of Ni and Ni-Cu Nanowires in Rectified Porous Anodic Alumina Membrane

Contributors:

Zuo, Y. (author) / Tang, J. (author) / Li, X.T. (author) / Zhao, Y. (author) / Gong, H.L. (author) / Qiu, S.L. (author) / Huang, Y.M.

Published in:

Optoelectronic Materials ; 1121-1124

MATERIALS SCIENCE FORUM ; 663/665

Publication date:

2011-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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