A platform for research: civil engineering, architecture and urbanism
Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer
Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer
Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer
2011-01-01
4 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Researching and Manufacturing of Endless Diamond Wire Saws and the Cutting Experiment
British Library Online Contents | 2008
|Cordless Reciprocating Saws Almost Come of Age
British Library Online Contents | 2001
|Ground cutting device using diamond wire saws and method of installing earthworks using the same
European Patent Office | 2020
|