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    Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

    New search for: Wang, X.Y.
    New search for: Li, Y.
    New search for: Li, S.J.
    New search for: Su, D.
    New search for: Zhang, Q.
    New search for: Zhu, S.

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    Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

    New search for: Wang, X.Y.
    New search for: Li, Y.
    New search for: Li, S.J.
    New search for: Su, D.
    New search for: Zhang, Q.
    New search for: Zhu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

    New search for: Wang, X.Y.
    New search for: Li, Y.
    New search for: Li, S.J.
    New search for: Su, D.
    New search for: Zhang, Q.
    New search for: Zhu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

    Contributors:

    Wang, X.Y. (author) / Li, Y. (author) / Li, S.J. (author) / Su, D. / Zhang, Q. / Zhu, S.

    Published in:

    Advanced Design and Manufacture III ; 296-299

    KEY ENGINEERING MATERIALS ; 450

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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