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Use of recalescence behavior analysis for the prediction of grain refinement in undercooled Cu–Ni alloy
Use of recalescence behavior analysis for the prediction of grain refinement in undercooled Cu–Ni alloy
Use of recalescence behavior analysis for the prediction of grain refinement in undercooled Cu–Ni alloy
Yang, W. (author) / Liu, F. (author) / Xu, Z. F. (author) / Lu, B. P. (author) / Yang, G. C. (author)
JOURNAL OF MATERIALS SCIENCE ; 46 ; 3101-3107
2011-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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