A platform for research: civil engineering, architecture and urbanism
Cracking of NiTi Thin Films Deposited on Cu Substrate
Cracking of NiTi Thin Films Deposited on Cu Substrate
Cracking of NiTi Thin Films Deposited on Cu Substrate
Li, Y.H. (author) / Meng, F.L. (author) / Zheng, W.T. (author) / Wang, Y.M. (author) / Ariffin, A.K. / Abdullah, S. / Ali, A. / Muchtar, A. / Ghazali, M.J. / Sajuri, Z.
2011-01-01
4 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Substrate-induced stress and the transformation behavior of sputter-deposited NiTi thin films
British Library Online Contents | 2003
|Shape memory NiTi thin films deposited at low temperature
British Library Online Contents | 1999
|Crack Spacing and the Flow Stress in NiTi Thin Films Deposited on Cu Substrate
British Library Online Contents | 2008
|NiTi shape memory alloy thin films deposited by co-evaporation
British Library Online Contents | 2005
|Compositional uniformity in sputter-deposited NiTi shape memory alloy thin films
British Library Online Contents | 2008
|