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    Extreme wettability due to dendritic copper nanostructure via electrodeposition

    New search for: Wang, P.
    New search for: Zhang, D.
    New search for: Qiu, R.

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    Extreme wettability due to dendritic copper nanostructure via electrodeposition

    New search for: Wang, P.
    New search for: Zhang, D.
    New search for: Qiu, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Extreme wettability due to dendritic copper nanostructure via electrodeposition

    New search for: Wang, P.
    New search for: Zhang, D.
    New search for: Qiu, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Extreme wettability due to dendritic copper nanostructure via electrodeposition

    Contributors:

    Wang, P. (author) / Zhang, D. (author) / Qiu, R. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 257 ; 8438-8442

    Publication date:

    2011-01-01

    Size:

    5 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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