Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method: Fid-Bau Portal

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

Chen, C. / Guo, H. / Chu, K. / Yin, F. / Zhang, X. / Han, Y. / Fan, Y.

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Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

Chen, C. / Guo, H. / Chu, K. / Yin, F. / Zhang, X. / Han, Y. / Fan, Y.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

Chen, C. / Guo, H. / Chu, K. / Yin, F. / Zhang, X. / Han, Y. / Fan, Y.

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Access via TIB

Check availability in my library

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Title:

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

Contributors:

Chen, C. (author) / Guo, H. (author) / Chu, K. (author) / Yin, F. (author) / Zhang, X. (author) / Han, Y. (author) / Fan, Y. (author)

Published in:

RARE METALS -BEIJING- ENGLISH EDITION ; 30 ; 408-413

Publication date:

2011-01-01

Size:

6 pages

ISSN:

1001-0521

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669

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