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Residual stress and nanomechanical properties of sonoelectrodeposited Cu films

Mallik, A. / Ray, B.C.

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Residual stress and nanomechanical properties of sonoelectrodeposited Cu films

Mallik, A. / Ray, B.C.

Residual stress and nanomechanical properties of sonoelectrodeposited Cu films

Mallik, A. / Ray, B.C.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Residual stress and nanomechanical properties of sonoelectrodeposited Cu films

Contributors:

Mallik, A. (author) / Ray, B.C. (author)

Published in:

SURFACE ENGINEERING -LONDON- ; 27 ; 551-556

Publication date:

2011-01-01

Size:

6 pages

ISSN:

0267-0844

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.44

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