Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites: Fid-Bau Portal

Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites

Zhang, C.Y. / Zhou, L. / Huang, S.T.

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Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites

Zhang, C.Y. / Zhou, L. / Huang, S.T.

Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites

Zhang, C.Y. / Zhou, L. / Huang, S.T.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Finite Element Simulation of Temperature Field during Grinding of SiCp/Al Composites

Contributors:

Zhang, C.Y. (author) / Zhou, L. (author) / Huang, S.T. (author)

Published in:

KEY ENGINEERING MATERIALS ; 487 ; 70-74

Publication date:

2011-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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