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    Chemical emissions from adhesive-bonded wood products at elevated temperatures

    New search for: Peng, Y.
    New search for: Shi, S. Q.
    New search for: Ingram, L.

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    Chemical emissions from adhesive-bonded wood products at elevated temperatures

    New search for: Peng, Y.
    New search for: Shi, S. Q.
    New search for: Ingram, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Chemical emissions from adhesive-bonded wood products at elevated temperatures

    New search for: Peng, Y.
    New search for: Shi, S. Q.
    New search for: Ingram, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Chemical emissions from adhesive-bonded wood products at elevated temperatures

    Contributors:

    Peng, Y. (author) / Shi, S. Q. (author) / Ingram, L. (author)

    Published in:

    WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 45 ; 627-644

    Publication date:

    2011-01-01

    Size:

    18 pages

    ISSN:

    0043-7719

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.12

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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