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    Formation Process of {001} Texture in Al-Cu Solid Solution during High Temperature Compression Deformation

    New search for: Okayasu, K.
    New search for: Takahata, S.
    New search for: Fukutomi, H.
    New search for: Tewari, A.
    New search for: Suwas, S.
    New search for: Srivastava, D.
    New search for: Samajdar, I.
    New search for: Haldar, A.

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    Formation Process of {001} Texture in Al-Cu Solid Solution during High Temperature Compression Deformation

    New search for: Okayasu, K.
    New search for: Takahata, S.
    New search for: Fukutomi, H.
    New search for: Tewari, A.
    New search for: Suwas, S.
    New search for: Srivastava, D.
    New search for: Samajdar, I.
    New search for: Haldar, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Formation Process of {001} Texture in Al-Cu Solid Solution during High Temperature Compression Deformation

    New search for: Okayasu, K.
    New search for: Takahata, S.
    New search for: Fukutomi, H.
    New search for: Tewari, A.
    New search for: Suwas, S.
    New search for: Srivastava, D.
    New search for: Samajdar, I.
    New search for: Haldar, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Title:

    Formation Process of {001} Texture in Al-Cu Solid Solution during High Temperature Compression Deformation

    Contributors:

    Okayasu, K. (author) / Takahata, S. (author) / Fukutomi, H. (author) / Tewari, A. / Suwas, S. / Srivastava, D. / Samajdar, I. / Haldar, A.

    Published in:

    Textures of Materials ICOTOM 16 ; 336-339

    MATERIALS SCIENCE FORUM ; 702/703

    Publication date:

    2012-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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