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Activation of Ceramics by Nanoscale Gold for Electroless Copper Plating

Wang, Y.-h. / Ma, H.-f. / Ma, F. / Ding, Y.-g.

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Activation of Ceramics by Nanoscale Gold for Electroless Copper Plating

Wang, Y.-h. / Ma, H.-f. / Ma, F. / Ding, Y.-g.

Activation of Ceramics by Nanoscale Gold for Electroless Copper Plating

Wang, Y.-h. / Ma, H.-f. / Ma, F. / Ding, Y.-g.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Activation of Ceramics by Nanoscale Gold for Electroless Copper Plating

Contributors:

Wang, Y.-h. (author) / Ma, H.-f. (author) / Ma, F. (author) / Ding, Y.-g. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 44 ; 36-39

Publication date:

2011-01-01

Size:

4 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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