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    Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

    New search for: Chang, S.Y.
    New search for: Jain, C.C.
    New search for: Chuang, T.H.
    New search for: Feng, L.P.
    New search for: Tsao, L.C.

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    Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

    New search for: Chang, S.Y.
    New search for: Jain, C.C.
    New search for: Chuang, T.H.
    New search for: Feng, L.P.
    New search for: Tsao, L.C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

    New search for: Chang, S.Y.
    New search for: Jain, C.C.
    New search for: Chuang, T.H.
    New search for: Feng, L.P.
    New search for: Tsao, L.C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

    Contributors:

    Chang, S.Y. (author) / Jain, C.C. (author) / Chuang, T.H. (author) / Feng, L.P. (author) / Tsao, L.C. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 32 ; 4720-4727

    Publication date:

    2011-01-01

    Size:

    8 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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