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    Microstructure and mechanical properties of the GH783/2.5D C/SiC joints brazed with Cu-Ti + Mo composite filler

    New search for: Wang, X.
    New search for: Cheng, L.
    New search for: Fan, S.
    New search for: Zhang, L.
    New search for: Leng, J.
    New search for: Mosallam, A.
    New search for: Lau, A.K.-T.

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    Microstructure and mechanical properties of the GH783/2.5D C/SiC joints brazed with Cu-Ti + Mo composite filler

    New search for: Wang, X.
    New search for: Cheng, L.
    New search for: Fan, S.
    New search for: Zhang, L.
    New search for: Leng, J.
    New search for: Mosallam, A.
    New search for: Lau, A.K.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and mechanical properties of the GH783/2.5D C/SiC joints brazed with Cu-Ti + Mo composite filler

    New search for: Wang, X.
    New search for: Cheng, L.
    New search for: Fan, S.
    New search for: Zhang, L.
    New search for: Leng, J.
    New search for: Mosallam, A.
    New search for: Lau, A.K.-T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure and mechanical properties of the GH783/2.5D C/SiC joints brazed with Cu-Ti + Mo composite filler

    Contributors:

    Wang, X. (author) / Cheng, L. (author) / Fan, S. (author) / Zhang, L. (author) / Leng, J. / Mosallam, A. / Lau, A.K.-T.

    Published in:

    Sustainable Materials, Design and Applications ; 499-504

    MATERIALS AND DESIGN -REIGATE- ; 36

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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