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    Microstructure and creep characteristics of Zn-3Cu-xAl ultra high-temperature lead-free solders

    New search for: Alibabaie, S.
    New search for: Mahmudi, R.

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    Microstructure and creep characteristics of Zn-3Cu-xAl ultra high-temperature lead-free solders

    New search for: Alibabaie, S.
    New search for: Mahmudi, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and creep characteristics of Zn-3Cu-xAl ultra high-temperature lead-free solders

    New search for: Alibabaie, S.
    New search for: Mahmudi, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Microstructure and creep characteristics of Zn-3Cu-xAl ultra high-temperature lead-free solders

    Contributors:

    Alibabaie, S. (author) / Mahmudi, R. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 39 ; 397-403

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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