Simulation Investigation Ultrasonically Assisted Grinding of SiC Ceramics with Single Diamond Abrasive Grain: Fid-Bau Portal

Simulation Investigation Ultrasonically Assisted Grinding of SiC Ceramics with Single Diamond Abrasive Grain

Cao, J.G. / Wu, Y.B. / Guo, H.R. / Li, Y.G. / Fujimoto, M. / Ohmura, A.

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Simulation Investigation Ultrasonically Assisted Grinding of SiC Ceramics with Single Diamond Abrasive Grain

Cao, J.G. / Wu, Y.B. / Guo, H.R. / Li, Y.G. / Fujimoto, M. / Ohmura, A.

Simulation Investigation Ultrasonically Assisted Grinding of SiC Ceramics with Single Diamond Abrasive Grain

Cao, J.G. / Wu, Y.B. / Guo, H.R. / Li, Y.G. / Fujimoto, M. / Ohmura, A.

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Document information

Title:

Simulation Investigation Ultrasonically Assisted Grinding of SiC Ceramics with Single Diamond Abrasive Grain

Contributors:

Cao, J.G. (author) / Wu, Y.B. (author) / Guo, H.R. (author) / Li, Y.G. (author) / Fujimoto, M. (author) / Ohmura, A. (author)

Published in:

KEY ENGINEERING MATERIALS ; 523/524 ; 178-183

Publication date:

2012-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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