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Electrochemical Corrosion Behavior of Copper Grounding Grid Material

Nie, X.-h. / Zheng, M.-c. / Li, J.-h.

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Electrochemical Corrosion Behavior of Copper Grounding Grid Material

Nie, X.-h. / Zheng, M.-c. / Li, J.-h.

Electrochemical Corrosion Behavior of Copper Grounding Grid Material

Nie, X.-h. / Zheng, M.-c. / Li, J.-h.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Electrochemical Corrosion Behavior of Copper Grounding Grid Material

Contributors:

Nie, X.-h. (author) / Zheng, M.-c. (author) / Li, J.-h. (author)

Published in:

CORROSION AND PROTECTION -NANCHANG- ; 33 ; 817-819

Publication date:

2012-01-01

Size:

3 pages

ISSN:

1005-748X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11223

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