A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Effect of Microelectroforming Parameters on Surface Morphology of Single-Side Copper Cladding Plate in the Presence of External Magnetic Field
Effect of Microelectroforming Parameters on Surface Morphology of Single-Side Copper Cladding Plate in the Presence of External Magnetic Field
Effect of Microelectroforming Parameters on Surface Morphology of Single-Side Copper Cladding Plate in the Presence of External Magnetic Field
Yang, F. (author) / Jia, W.-p. (author) / Wu, M.-H. (author)
MATERIALS PROTECTION -WUHAN- ; 45 ; 48-51
2012-01-01
4 pages
Article (Journal)
Unknown
DDC:
620.1
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