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    Effect of additive and current density on microstructure and texture characteristics of copper electrodeposits

    New search for: Manu, R.
    New search for: Jayakrishnan, S.

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    Effect of additive and current density on microstructure and texture characteristics of copper electrodeposits

    New search for: Manu, R.
    New search for: Jayakrishnan, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of additive and current density on microstructure and texture characteristics of copper electrodeposits

    New search for: Manu, R.
    New search for: Jayakrishnan, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Effect of additive and current density on microstructure and texture characteristics of copper electrodeposits

    Contributors:

    Manu, R. (author) / Jayakrishnan, S. (author)

    Published in:

    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 104 ; 149-156

    Publication date:

    2013-01-01

    Size:

    8 pages

    ISSN:

    1862-5282

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669.9

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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