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    Establishment of Substance Flow Model of Nickel in Electroplating Industry and Countermeasures for Discharge Reduction

    New search for: Yang, J.
    New search for: Wen, Y.
    New search for: Xing, Y.-m.

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    Establishment of Substance Flow Model of Nickel in Electroplating Industry and Countermeasures for Discharge Reduction

    New search for: Yang, J.
    New search for: Wen, Y.
    New search for: Xing, Y.-m.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Establishment of Substance Flow Model of Nickel in Electroplating Industry and Countermeasures for Discharge Reduction

    New search for: Yang, J.
    New search for: Wen, Y.
    New search for: Xing, Y.-m.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Establishment of Substance Flow Model of Nickel in Electroplating Industry and Countermeasures for Discharge Reduction

    Contributors:

    Yang, J. (author) / Wen, Y. (author) / Xing, Y.-m. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 46 ; 13-15

    Publication date:

    2013-01-01

    Size:

    3 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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