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    Interfacial microstructure and mechanical properties of diffusion bonded TC4/0Cr18Ni9/Oxygen Free Copper joints

    New search for: Shen, Q.
    New search for: Xiang, H.
    New search for: Luo, Q.
    New search for: Su, X.
    New search for: Zhang, L.

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    Interfacial microstructure and mechanical properties of diffusion bonded TC4/0Cr18Ni9/Oxygen Free Copper joints

    New search for: Shen, Q.
    New search for: Xiang, H.
    New search for: Luo, Q.
    New search for: Su, X.
    New search for: Zhang, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial microstructure and mechanical properties of diffusion bonded TC4/0Cr18Ni9/Oxygen Free Copper joints

    New search for: Shen, Q.
    New search for: Xiang, H.
    New search for: Luo, Q.
    New search for: Su, X.
    New search for: Zhang, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Interfacial microstructure and mechanical properties of diffusion bonded TC4/0Cr18Ni9/Oxygen Free Copper joints

    Contributors:

    Shen, Q. (author) / Xiang, H. (author) / Luo, Q. (author) / Su, X. (author) / Zhang, L. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 50 ; 230-234

    Publication date:

    2013-01-01

    Size:

    5 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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