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    Effect of Different Cooling Paths on the Microstructure and Properties of a Plain Carbon Steel

    New search for: Guo, J.
    New search for: Hu, S.P.
    New search for: Mi, Z.L.
    New search for: Zhang, D.B.
    New search for: Karjalainen, L.P.
    New search for: Porter, D.A.
    New search for: Jarvenpaa, S.A.

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    Effect of Different Cooling Paths on the Microstructure and Properties of a Plain Carbon Steel

    New search for: Guo, J.
    New search for: Hu, S.P.
    New search for: Mi, Z.L.
    New search for: Zhang, D.B.
    New search for: Karjalainen, L.P.
    New search for: Porter, D.A.
    New search for: Jarvenpaa, S.A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Different Cooling Paths on the Microstructure and Properties of a Plain Carbon Steel

    New search for: Guo, J.
    New search for: Hu, S.P.
    New search for: Mi, Z.L.
    New search for: Zhang, D.B.
    New search for: Karjalainen, L.P.
    New search for: Porter, D.A.
    New search for: Jarvenpaa, S.A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Effect of Different Cooling Paths on the Microstructure and Properties of a Plain Carbon Steel

    Contributors:

    Guo, J. (author) / Hu, S.P. (author) / Mi, Z.L. (author) / Zhang, D.B. (author) / Karjalainen, L.P. / Porter, D.A. / Jarvenpaa, S.A.

    Published in:

    Physical and Numerical Simulation of Materials Processing VII ; 171-175

    MATERIALS SCIENCE FORUM ; 762

    Publication date:

    2013-01-01

    Size:

    5 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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