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Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging
Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging
Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging
Jiang, H. W. (author) / Li, N. (author) / Xiong, Y. Y. (author) / Li, Z. G. (author) / Liu, L. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 593 ; 127-135
2014-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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