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Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness
Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness
Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness
Tran, H. T. (author) / Shirangi, M. H. (author) / Pang, X. (author) / Volinsky, A. A. (author)
INTERNATIONAL JOURNAL OF FRACTURE ; 185 ; 115-127
2014-01-01
13 pages
Article (Journal)
English
DDC:
620.1126
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