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    A three-dimensional dislocation dynamics study of the effects of grain size and shape on strengthening behavior of fcc Cu

    New search for: Yellakara, R. N.
    New search for: Wang, Z.

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    A three-dimensional dislocation dynamics study of the effects of grain size and shape on strengthening behavior of fcc Cu

    New search for: Yellakara, R. N.
    New search for: Wang, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A three-dimensional dislocation dynamics study of the effects of grain size and shape on strengthening behavior of fcc Cu

    New search for: Yellakara, R. N.
    New search for: Wang, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    A three-dimensional dislocation dynamics study of the effects of grain size and shape on strengthening behavior of fcc Cu

    Contributors:

    Yellakara, R. N. (author) / Wang, Z. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 87 ; 253-259

    Publication date:

    2014-01-01

    Size:

    7 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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