Characterization of Damage Induced by Electric Discharge Machining and Wiresawing with Loose Abrasive at Subsurface of SiC Crystal: Fid-Bau Portal

Characterization of Damage Induced by Electric Discharge Machining and Wiresawing with Loose Abrasive at Subsurface of SiC Crystal

Ishikawa, Y. / Yao, Y.Z. / Sato, K. / Sugawara, Y. / Okamoto, Y. / Hayashi, N.

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Characterization of Damage Induced by Electric Discharge Machining and Wiresawing with Loose Abrasive at Subsurface of SiC Crystal

Ishikawa, Y. / Yao, Y.Z. / Sato, K. / Sugawara, Y. / Okamoto, Y. / Hayashi, N.

Characterization of Damage Induced by Electric Discharge Machining and Wiresawing with Loose Abrasive at Subsurface of SiC Crystal

Ishikawa, Y. / Yao, Y.Z. / Sato, K. / Sugawara, Y. / Okamoto, Y. / Hayashi, N.

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Title:

Characterization of Damage Induced by Electric Discharge Machining and Wiresawing with Loose Abrasive at Subsurface of SiC Crystal

Contributors:

Ishikawa, Y. (author) / Yao, Y.Z. (author) / Sato, K. (author) / Sugawara, Y. (author) / Okamoto, Y. (author) / Hayashi, N. (author) / Okumura, H. / Harima, H. / Kimoto, T. / Yoshimoto, M.

Published in:

Silicon Carbide and Related Materials 2013 PART 1 Selected, peer reviewed papers from the 15^t^h International Conference on Silicon Carbide and Related Materials, (ICSCRM 2013), September 29 - October 4, 2013, Miyazaki, Japan ; 362-365

MATERIALS SCIENCE FORUM ; 778/780

Publication date:

2014-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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