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Characteristics of a Schottky Barrier Diode and the SiC Wafers Sliced by Wire Electrical Discharge Machining
Characteristics of a Schottky Barrier Diode and the SiC Wafers Sliced by Wire Electrical Discharge Machining
Characteristics of a Schottky Barrier Diode and the SiC Wafers Sliced by Wire Electrical Discharge Machining
Miyake, H. (author) / Tomita, N. (author) / Nakaki, Y. (author) / Furusho, T. (author) / Itokazu, A. (author) / Hashimoto, T. (author) / Toyoda, Y. (author) / Yamakawa, S. (author) / Sumitani, H. (author) / Kuroiwa, T. (author)
2014-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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