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Controlled electropolishing of copper foils at elevated temperature
Controlled electropolishing of copper foils at elevated temperature
Controlled electropolishing of copper foils at elevated temperature
Kwon, G. D. (author) / Kim, Y. W. (author) / Moyen, E. (author) / Keum, D. H. (author) / Lee, Y. H. (author) / Baik, S. (author) / Pribat, D. (author)
APPLIED SURFACE SCIENCE ; 307 ; 731-735
2014-01-01
5 pages
Article (Journal)
English
DDC:
621.35
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