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    Optimization of Electroless Nickel Plating Process for Mica Powder as Conductive Filler

    New search for: Chen, J.-g.
    New search for: Tang, C.

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    Optimization of Electroless Nickel Plating Process for Mica Powder as Conductive Filler

    New search for: Chen, J.-g.
    New search for: Tang, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Optimization of Electroless Nickel Plating Process for Mica Powder as Conductive Filler

    New search for: Chen, J.-g.
    New search for: Tang, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Optimization of Electroless Nickel Plating Process for Mica Powder as Conductive Filler

    Contributors:

    Chen, J.-g. (author) / Tang, C. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 47 ; 34-36

    Publication date:

    2014-01-01

    Size:

    3 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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