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    Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

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    New search for: Guan, Q.
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    New search for: Tao, J.

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    Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

    New search for: Deng, Y.
    New search for: Guan, Q.
    New search for: Wu, B.
    New search for: Wang, X.
    New search for: Tao, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

    New search for: Deng, Y.
    New search for: Guan, Q.
    New search for: Wu, B.
    New search for: Wang, X.
    New search for: Tao, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

    Contributors:

    Deng, Y. (author) / Guan, Q. (author) / Wu, B. (author) / Wang, X. (author) / Tao, J. (author)

    Published in:

    MATERIALS LETTERS ; 129 ; 43-45

    Publication date:

    2014-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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