Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Disbond monitoring in adhesive joints using shear stress optical fiber sensors

    New search for: Sulejmani, S.
    New search for: Sonnenfeld, C.
    New search for: Geernaert, T.
    New search for: Luyckx, G.
    New search for: Mergo, P.
    New search for: Urbanczyk, W.
    New search for: Chah, K.
    New search for: Thienpont, H.
    New search for: Berghmans, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Disbond monitoring in adhesive joints using shear stress optical fiber sensors

    New search for: Sulejmani, S.
    New search for: Sonnenfeld, C.
    New search for: Geernaert, T.
    New search for: Luyckx, G.
    New search for: Mergo, P.
    New search for: Urbanczyk, W.
    New search for: Chah, K.
    New search for: Thienpont, H.
    New search for: Berghmans, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Disbond monitoring in adhesive joints using shear stress optical fiber sensors

    New search for: Sulejmani, S.
    New search for: Sonnenfeld, C.
    New search for: Geernaert, T.
    New search for: Luyckx, G.
    New search for: Mergo, P.
    New search for: Urbanczyk, W.
    New search for: Chah, K.
    New search for: Thienpont, H.
    New search for: Berghmans, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Disbond monitoring in adhesive joints using shear stress optical fiber sensors

    Contributors:

    Sulejmani, S. (author) / Sonnenfeld, C. (author) / Geernaert, T. (author) / Luyckx, G. (author) / Mergo, P. (author) / Urbanczyk, W. (author) / Chah, K. (author) / Thienpont, H. (author) / Berghmans, F. (author)

    Published in:

    Selected papers from the 7th World Congress on Biomimetics, Artificial Muscles and Nano-Bio (BAMN2013) ; 075006

    SMART MATERIALS AND STRUCTURES ; 23

    Publication date:

    2014-01-01

    Size:

    75006 pages

    ISSN:

    0964-1726

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Adhesive disbond detection using piezoelectric wafer active sensors [9437-28]

    British Library Conference Proceedings | 2015

    Imaging of disbond in adhesive joints with Lamb waves [2944-18]

    Mustafa, V. / Chahbaz, A. / Hay, D. R. et al. | British Library Conference Proceedings | 1996

    Disbond growth detection in composite-composite single-lap joints using chirped FBG sensors

    Palaniappan, J. / Ogin, S. L. / Thorne, A. M. et al. | British Library Online Contents | 2008

    Influence of disbond on notch crack behaviour in single bonded lap joints

    Ouinas, D. / Bouiadjra, B. Bachir / Achour, T. et al. | Elsevier | 2010

    Influence of Disbond Defects on the Dispersion Properties of Adhesive Bonding Structures

    Chang, X.L. / Ni, T. / Ai, C.A. | British Library Online Contents | 2009

    Back to top