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    Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

    New search for: Zhu, D.
    New search for: Yan, S.
    New search for: Li, B.

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    Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

    New search for: Zhu, D.
    New search for: Yan, S.
    New search for: Li, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

    New search for: Zhu, D.
    New search for: Yan, S.
    New search for: Li, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness

    Contributors:

    Zhu, D. (author) / Yan, S. (author) / Li, B. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 92 ; 13-21

    Publication date:

    2014-01-01

    Size:

    9 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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