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Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking
Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking
Elastomeric Thermal Interface Materials with High Through-Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking
Uetani, K. (author) / Ata, S. (author) / Tomonoh, S. (author) / Yamada, T. (author) / Yumura, M. (author) / Hata, K. (author)
ADVANCED MATERIALS -DEERFIELD BEACH THEN WEINHEIM- ; 26 ; 5857-5862
2014-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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