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    Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

    New search for: Islam, M.M.
    New search for: Huang, H.

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    Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

    New search for: Islam, M.M.
    New search for: Huang, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

    New search for: Islam, M.M.
    New search for: Huang, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

    Contributors:

    Islam, M.M. (author) / Huang, H. (author)

    Published in:

    SMART MATERIALS AND STRUCTURES ; 23 ; 125037

    Publication date:

    2014-01-01

    Size:

    125037 pages

    ISSN:

    0964-1726

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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