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    Nanoscale investigation of the interface situation of plated nickel and thermally formed nickel silicide for silicon solar cell metallization

    New search for: Mondon, A.
    New search for: Wang, D.
    New search for: Zuschlag, A.
    New search for: Bartsch, J.
    New search for: Glatthaar, M.
    New search for: Glunz, S. W.

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    Nanoscale investigation of the interface situation of plated nickel and thermally formed nickel silicide for silicon solar cell metallization

    New search for: Mondon, A.
    New search for: Wang, D.
    New search for: Zuschlag, A.
    New search for: Bartsch, J.
    New search for: Glatthaar, M.
    New search for: Glunz, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Nanoscale investigation of the interface situation of plated nickel and thermally formed nickel silicide for silicon solar cell metallization

    New search for: Mondon, A.
    New search for: Wang, D.
    New search for: Zuschlag, A.
    New search for: Bartsch, J.
    New search for: Glatthaar, M.
    New search for: Glunz, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Nanoscale investigation of the interface situation of plated nickel and thermally formed nickel silicide for silicon solar cell metallization

    Contributors:

    Mondon, A. (author) / Wang, D. (author) / Zuschlag, A. (author) / Bartsch, J. (author) / Glatthaar, M. (author) / Glunz, S. W. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 323 ; 31-39

    Publication date:

    2014-01-01

    Size:

    9 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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