Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications: Fid-Bau Portal

Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications

Xia, H. / Drymiotis, F. / Chen, C. L. / Wu, A. / Chen, Y. Y. / Jeffrey Snyder, G.

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Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications

Xia, H. / Drymiotis, F. / Chen, C. L. / Wu, A. / Chen, Y. Y. / Jeffrey Snyder, G.

Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications

Xia, H. / Drymiotis, F. / Chen, C. L. / Wu, A. / Chen, Y. Y. / Jeffrey Snyder, G.

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Check availability in my library

Order at Subito €

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Document information

Title:

Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications

Contributors:

Xia, H. (author) / Drymiotis, F. (author) / Chen, C. L. (author) / Wu, A. (author) / Chen, Y. Y. (author) / Jeffrey Snyder, G. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 50 ; 2700-2708

Publication date:

2015-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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