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Thermal behavior of copper processed by ECAP with and without back pressure
Thermal behavior of copper processed by ECAP with and without back pressure
Thermal behavior of copper processed by ECAP with and without back pressure
Wang, Y. L. (author) / Lapovok, R. (author) / Wang, J. T. (author) / Qi, Y. S. (author) / Estrin, Y. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 628 ; 21-29
2015-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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